- Design Complexity & Engineering Time
• Multilayer PCBs (especially 8+ layers), HDI designs, and impedance control require longer engineering time.
• Unclear documentation or last-minute design changes can cause 1–2 day delays.
- Material & Supply Chain Risks
• Fluctuations in copper foil, special base materials, and IC chip availability can extend procurement time.
• Global component shortages may prolong lead times by 30%–50%.
- Manufacturing Process & Quality Control
• Special processes such as via-in-pad, heavy copper, or castellated holes require separate scheduling and add time.
• Lack of First Article Inspection (FAI) increases the chance of rework, causing 2–3 days of additional delay.
- Production Issues & External Disruptions
• High-difficulty boards like HDI may require re-fabrication in case of defects.
• Logistics constraints, regulations (e.g. environmental restrictions), and unexpected events (e.g. quarantines) can also impact delivery.
- Order Volume & Capacity Allocation
• Large orders often need batch processing, while small-volume jobs may be prioritized.
• Limited production capacity or poor scheduling can lead to extended delivery times.
How to Improve Delivery Reliability:
• Finalize design and engineering requirements early
• Maintain safety stock for critical materials
• Ensure thorough production testing and reporting
• Align expectations and timelines in contracts
• Start with trial orders before scaling up
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